Technical Program

Thursday, June 03, 2010

Session 18: Materials and Processing for 3D Packaging
8:00 AM - 11:40 AM
Committee: Materials & Processing
Champagne 4

Session Co-Chairs:

Kwang-Lung Lin
National Cheng Kung University
T +886-6-2762709
F +886-6-2759602
matkllin@mail.ncku.edu.tw

Rajen Chanchani
Sandia National Laboratory
T +1-505-844-3482
F +1-505-844-0019
chanchr@sandia.gov

Papers:

1. 8:00 AM - Low Temperature PECVD of Dielectric Films for TSV Applications
D. Archard- SPTS UK
K. Giles- SPTS UK
A. Price- SPTS UK
S. Burgess- SPTS UK
K. Buchanan- SPTS UK

2. 8:25 AM - A Comparison of Thin Film Polymers for Wafer Level Packaging
Michael Töpper- Fraunhofer IZM
Thorsten Fischer- Fraunhofer IZM
Tobias Baumgartner- Fraunhofer IZM
Herbert Reichl- Fraunhofer IZM

3. 8:50 AM - Fast Electroplating TSV Process Development for the Via-Last Approach
H.Y. Li - Institute of Microelectronics, A*STAR
E. Liao- Institute of Microelectronics, A*STAR
X.F. Pang- Institute of Microelectronics, A*STAR
H. Yu- Shanghai Sinyang Semiconductor Materials Co., Ltd.
X.X. Yu- Shanghai Sinyang Semiconductor Materials Co., Ltd.
J.Y. Sun- Shanghai Sinyang Semiconductor Materials Co., Ltd.

4. 10:00 AM - Effect of Ag Grain Size on High Temperature Joint Formation in Ag-In System
Pin J. Wang- Intel Corporation
Chu-Hsuan Sha- University of California, Irvine
Chin C. Lee- University of California, Irvine

5. 10:25 AM - Multi Channel High Aspect Ratio Glass Microelectrode Array for Neuroprosthetic Applications
Sandeep Negi- Blackrock Microsystems
Rajmohan Bhandari- Blackrock Microsystems

6. 10:50 AM - Tungsten as a CMOS Compatible Catalyst for the Metal-Assisted Chemical Etching of Silicon to Create 2D and 3D Nanostructures
Owen Hildreth- Georgia Institute of Technology
Carlos Alvarez- Georgia Institute of Technology
C.P. Wong- Georgia Institute of Technology

7. 11:15 AM - 3D Interconnection Process Development and Integration with Low Stress TSV
T.T. Chua- Institute of Microelectronics, A*STAR
S.W. Ho- Institute of Microelectronics, A*STAR
H.Y. Li- Institute of Microelectronics, A*STAR
C.H. Khong- Institute of Microelectronics, A*STAR
E.B. Liao- Institute of Microelectronics, A*STAR
S.P. Chew- Institute of Microelectronics, A*STAR
W.S. Lee- Institute of Microelectronics, A*STAR
L.S. Lim- Institute of Microelectronics, A*STAR
X.F. Pang- Institute of Microelectronics, A*STAR
S.L. Kriangsak- United Test and Assembly Center, Ltd.
C. Ng- United Test and Assembly Center, Ltd.
S. Nathapong- United Test and Assembly Center, Ltd.