Technical Program

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Wednesday, June 02, 2010

Session 10: Bonding Interconnects
1:30 PM - 5:10 PM
Committee: Materials & Processing
Champagne 2

Session Co-Chairs:

Dong Wook Kim Xilinx Corporation T +1-408-626-6374 F +1-408-559-9237 dongk@xilinx.com

Kyung-Wook Paik KAIST T +82-42-350-3335 F +82-42-350-8124 kwpaik@kaist.ac.kr

Papers:

1. 1:30 PM - High Power and Fine Pitch Assembly Using Solder Anisotropic Conductive Films (ACFs) Combined with Ultrasonic Bonding Technique
Kiwon Lee- KAIST
Kyung Wook Paik- KAIST

2. 1:55 PM - Gold-Gold Interconnects to Copper Pillar Using Fast Thermal Compression Bonding Using Non-Conductive Paste
D. Frye- Henkel Corporation
R. Guino- Henkel Corporation
S. Gupta- Henkel Corporation
M. Sano- Henkel Corporation
K. Sato- Henkel Corporation
K. Iida- Henkel Corporation

3. 2:20 PM - Alternative Patterning Techniques Enabling Fine Pitch Interconnection on Topography Surfaces
F. Iker- IMEC
T. Funaya- NEC Corporation
G. Jamieson- IMEC
E. Beyne- IMEC

4. 3:30 PM - Influence of Bonding Atmosphere on Low-Temperature Wafer Bonding
Ying-Hui Wang- University of Tokyo
Tadatomo Suga- University of Tokyo

5. 3:55 PM - High-Speed Laser Plating on Cu Leadframe Using Ag Nanoparticles
Katsuhiro Maekawa- Ibaraki University
Kazuhiko Yamasaki- Ibaraki University
Tomotake Niizeki- Ibaraki University
Mamoru Mita- Hitachi
Yorishige Matsuba- Harima Chemicals, Inc.
Nobuto Terada- Harima Chemicals, Inc.
Hiroshi Saito- Harima Chemicals, Inc.

6. 4:20 PM - Bonding/Barrier Layers on Bismuth Telluride (Bi2Te3) for High Temperature Applications
Wen P. Lin- University of California, Irvine
Pin J. Wang- University of California, Irvine
Chin C. Lee- University of California, Irvine

7. 4:45 PM - Testing and Prevention of Head-In-Pillow
Yan Liu- Indium Corporation
Pamela Fiacco- Indium Corporation
Ning-Cheng Lee- Indium Corporation