Emerging Technologies

Major Topics: Wearable and Medical Electronics, Flexible, Bendable, Stretchable, Disposable, or Dissolvable Packaging, Bio-Sensor Packaging, Implantable Device Packaging, New Materials and Methods for Packaging Microfluidics, MEMS and NEMS, Nano-Battery. 3D Printing, Self-Alignment and Assembly, New Additive Packaging Process Technologies and Materials. Novel Substrates, Materials an Approaches to Interconnects and Packaging, Packaging for Wireless, Photovoltaic, Redundancy, Repair, Security, Anti Counterfeiting, Components for Internet of Things (IoT) and Smart Electronics, Heterogeneous Integration. Compact & Autonomous Sensor Packaging, Wafer Level Integrated Silicon Photonics.

Chair
Vaidyanathan Chelakara
Acacia Communications

50 Allanford Ave.
Ottawa None K1T 3Z6
Canada
Phone: +1-613-720-2994
Email: Click Here
Assistant Chair
Florian Herrault
HRL Laboratories, LLC

3011 Malibu Canyon Road
Malibu CA 90265
USA
Phone: +1-310-317-5269
Email: Click Here
Isaac Robin Abothu
Siemens Healthineers
Ultrasound Division
22010 SE 51st Street
Issaquah WA 98029
USA
Phone: +1-425-557-1288
Email: Click Here
Ankur Agrawal
Intel Corporation
CH5-165
5000 W. Chandler Blvd.
Chandler AZ 85226
USA
Phone:
Email: Click Here
Meriem Akin
Leibniz Universitaet Hannover
Institute of Micro-Production Technology
An der Universitaet 2
Garbsen Lower Saxony 30823
Germany
Phone: +49-(0)511/762-5747
Email: Click Here
Vasudeva P. Atluri
Renavitas Technologies
Suite 107-127
20701 N. Scottsdale Rd
Scottsdale AZ 85255

Phone: +1-480-704-4846
Email: Click Here
Mark Bachman
University of California, Irvine

2227 Engineering Gateway
Irvine CA 92697
USA
Phone: +1-949-824-6421
Email: Click Here
Karlheinz Bock
Technische Universitat Dresden
Institut für Aufbau- und Verbindungstechnik der Elektronik

Dresden 01062
Germany
Phone: +49-351-46336345
Email: Click Here
Benson Chan
Binghamton University
IEEC, Center of Excellence Building Office 1109
85 Murray Hill Rd
Vestal NY 13850
USA
Phone: +1-607-777-4349
Email: Click Here
Rabindra N. Das
MIT Lincoln Labs
Advanced Technology Division
244 Wood St.
Lexington MA 02420
USA
Phone: +1-781-981-1318
Email: Click Here
Ajit Dubey
GlobalFoundries

2600 Great America Way
Santa Clara CA 95054
USA
Phone: 408-904-8445
Email: Click Here
TengFei Jiang
University of Central Florida

4000 Central Florida Blvd
Orlando FL 32816
USA
Phone: 407-823-2284
Email: Click Here
Ramakrishna Kotlanka
Analog Devices
Mail Stop:113
804 Woburn Street
Wilmington MA 01887-3494
USA
Phone: +1-781-937-1076
Email: Click Here
Kevin J. Lee
Qorvo Corporation

2300 NE Brookwood Parkway
Hillsboro OR 97124
USA
Phone: +1-503-615-9151
Email: Click Here
Menglu Li
Apple Inc.

1 Infinite Loop
Cupertino CA 95014
USA
Phone: +1-424-278-5674
Email: Click Here
Bharat Penmecha
Intel Corporation
CH5-157
5000 W. Chandler Blvd.
Chandler AZ 85226
USA
Phone: +1-480-552-2511
Email: Click Here
C. S. Premachandran
GLOBALFOUNDRIES
QRA-Reliability
400 Stonebreak Rd.
Malta NY 12020
USA
Phone: +1-518-305-7317
Email: Click Here
Jintang Shang
Southeast University
Key Lab of MEMS of Education Ministry,Southeast University, Sipailou 2, Nanjing, P.R. China
Sipailou 2
Nanjing 210096
P.R. China
Phone: +86 13913869603
Email: Click Here
Nancy Stoffel
GE Global Research
KW-B1327
1 Research Circle
Niskayuna NY 12309
USA
Phone: +1-518-387-4529
Email: Click Here
Liu Yang
IBM

1101 Kitchawan Rd
Yorktown Heights NY 10598
USA
Phone: 914-330-9341
Email: Click Here
Jimin Yao
Intel Corporation
CH5-165
5000 W. Chandler Blvd
Chandler AZ 85226
United States
Phone: +1-217-299-7362
Email: Click Here
W. Hong Yeo
Georgia Institute of Technology
Pettit Microelectronics Research Center
791 Atlanta Drive NW
Atlanta GA 30332
USA
Phone: +1-404-894-3200
Email: Click Here
Yue Zhang
Oracle

4190 Network Cir
Santa Clara CA 95054
USA
Phone: +1-424-278-5674
Email: Click Here
Hongqing Zhang
IBM

2070 Route 52
Hopewell Jct NY 12533
USA
Phone: 484-896-8709
Email: Click Here