Emerging Technologies
Major Topics: Wearable and Medical Electronics, Flexible, Bendable, Stretchable, Disposable, or Dissolvable Packaging, Bio-Sensor Packaging, Implantable Device Packaging, New Materials and Methods for Packaging Microfluidics, MEMS and NEMS, Nano-Battery. 3D Printing, Self-Alignment and Assembly, New Additive Packaging Process Technologies and Materials. Novel Substrates, Materials an Approaches to Interconnects and Packaging, Packaging for Wireless, Photovoltaic, Redundancy, Repair, Security, Anti Counterfeiting, Components for Internet of Things (IoT) and Smart Electronics, Heterogeneous Integration. Compact & Autonomous Sensor Packaging, Wafer Level Integrated Silicon Photonics.
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Chair
Florian Herrault HRL Laboratories, LLC 3011 Malibu Canyon Road Malibu CA 90265 USA Phone: +1-310-317-5269 Email: Click Here |
Assistant Chair
Benson Chan Binghamton University IEEC, Center of Excellence Building Office 1109 85 Murray Hill Rd Vestal NY 13850 USA Phone: +1-607-777-4349 Email: Click Here |
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Isaac Robin Abothu
Siemens Healthineers Ultrasound Division 22010 SE 51st Street Issaquah WA 98029 USA Phone: +1-425-557-1288 Email: Click Here |
Meriem Akin
Robert Bosch GmBH Postfach 10 02 61 Hildesheim 31102 Germany Phone: +495121496175 Email: Click Here |
Vasudeva P. Atluri
Renavitas Technologies Suite 107-127 20701 N. Scottsdale Rd Scottsdale AZ 85255 Phone: +1-480-704-4846 Email: Click Here |
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Karlheinz Bock
Technische Universitat Dresden Institut für Aufbau- und Verbindungstechnik der Elektronik Mommsenstrasse 15 Dresden 01062 Germany Phone: +49-351-46336345 Email: Click Here |
Vaidyanathan Chelakara
Acacia Communications 50 Allanford Ave. Ottawa None K1T 3Z6 Canada Phone: +1-613-720-2994 Email: Click Here |
Rabindra N. Das
MIT Lincoln Labs Advanced Technology Division 244 Wood St. Lexington MA 02420 USA Phone: +1-781-981-1318 Email: Click Here |
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Dongming He
Qualcomm Technologies, Inc. 5775 Morehouse Drive San Diego CA 92121 USA Phone: +1-858-651-8139 Email: Click Here |
TengFei Jiang
University of Central Florida 4000 Central Florida Blvd Orlando FL 32816 USA Phone: 407-823-2284 Email: Click Here |
Jong-Hoon Kim
Washington State University Vancouver School of Engineering and Computer Science 14204 NE Salmon Creek Avenue Vancouver WA 98686-9600 USA Phone: +1-360 546-9250 Email: Click Here |
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Ahyeon Koh
Binghamton University P.O. Box 6000 Binghamton NY 13902 USA Phone: +1-607-777-5422 Email: Click Here |
Ramakrishna Kotlanka
Analog Devices Mail Stop:113 804 Woburn Street Wilmington MA 01887-3494 USA Phone: +1-781-937-1076 Email: Click Here |
Santosh Kudtarkar
Analog Devices 804 Woburn Street Wilmington MA 01887 USA Phone: +1-781-9372462 Email: Click Here |
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Kevin J. Lee
Qorvo Corporation 2300 NE Brookwood Parkway Hillsboro OR 97124 USA Phone: +1-503-615-9151 Email: Click Here |
Zhuo Li
Fudan University Materials Science Building 1, Room 504 220 Handan Road Shanghai 200433 China Phone: +86-21-65643267 Email: Click Here |
Chukwudi Okoro
Corning Mechanics and Reliability Sciences Dept. 1 Science Center Drive Corning NY 14831 USA Phone: +1-607-248-0717 Email: Click Here |
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Bharat Penmecha
Intel Corporation CH5-157 5000 W. Chandler Blvd. Chandler AZ 85226 USA Phone: +1-480-552-2511 Email: Click Here |
C. S. Premachandran
GLOBALFOUNDRIES QRA-Reliability 400 Stonebreak Rd. Malta NY 12020 USA Phone: +1-518-305-7317 Email: Click Here |
Jintang Shang
Southeast University Key Lab of MEMS of Education Ministry,Southeast University, Sipailou 2, Nanjing, P.R. China Sipailou 2 Nanjing 210096 P.R. China Phone: +86 13913869603 Email: Click Here |
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Rohit Sharma
IIT Ropar Room # 109 Nangal Road Rupnagar PB 140001 India Phone: +91-8288002273 Email: Click Here |
Nancy Stoffel
GE Research KW-B1327 1 Research Circle Niskayuna NY 12309 USA Phone: +1-518-387-4529 Email: Click Here |
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Jimin Yao
Intel Corporation CH5-165 5000 W. Chandler Blvd Chandler AZ 85226 United States Phone: +1-217-299-7362 Email: Click Here |
W. Hong Yeo
Georgia Institute of Technology Pettit Microelectronics Research Center 791 Atlanta Drive NW Atlanta GA 30332 USA Phone: +1-404-894-3200 Email: Click Here |
Hongqing Zhang
IBM Corporation 2070 Route 52 Hopewell Jct NY 12533 USA Phone: 484-896-8709 Email: Click Here |
