Emerging Technologies
Major Topics: Wearable and Medical Electronics, Flexible, Bendable, Stretchable, Disposable, or Dissolvable Packaging, Bio-Sensor Packaging, Implantable Device Packaging, New Materials and Methods for Packaging Microfluidics, MEMS and NEMS, Nano-Battery. 3D Printing, Self-Alignment and Assembly, New Additive Packaging Process Technologies and Materials. Novel Substrates, Materials an Approaches to Interconnects and Packaging, Packaging for Wireless, Photovoltaic, Redundancy, Repair, Security, Anti Counterfeiting, Components for Internet of Things (IoT) and Smart Electronics, Heterogeneous Integration. Compact & Autonomous Sensor Packaging, Wafer Level Integrated Silicon Photonics.
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Chair
Vaidyanathan Chelakara Acacia Communications 50 Allanford Ave. Ottawa None K1T 3Z6 Canada Phone: +1-613-720-2994 Email: Click Here |
Assistant Chair
Florian Herrault HRL Laboratories, LLC 3011 Malibu Canyon Road Malibu CA 90265 USA Phone: +1-310-317-5269 Email: Click Here |
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Isaac Robin Abothu
Siemens Healthineers Ultrasound Division 22010 SE 51st Street Issaquah WA 98029 USA Phone: +1-425-557-1288 Email: Click Here |
Ankur Agrawal
Intel Corporation CH5-165 5000 W. Chandler Blvd. Chandler AZ 85226 USA Phone: Email: Click Here |
Meriem Akin
Leibniz Universitaet Hannover Institute of Micro-Production Technology An der Universitaet 2 Garbsen Lower Saxony 30823 Germany Phone: +49-(0)511/762-5747 Email: Click Here |
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Vasudeva P. Atluri
Renavitas Technologies Suite 107-127 20701 N. Scottsdale Rd Scottsdale AZ 85255 Phone: +1-480-704-4846 Email: Click Here |
Mark Bachman
University of California, Irvine 2227 Engineering Gateway Irvine CA 92697 USA Phone: +1-949-824-6421 Email: Click Here |
Karlheinz Bock
Technische Universitat Dresden Institut für Aufbau- und Verbindungstechnik der Elektronik Dresden 01062 Germany Phone: +49-351-46336345 Email: Click Here |
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Benson Chan
Binghamton University IEEC, Center of Excellence Building Office 1109 85 Murray Hill Rd Vestal NY 13850 USA Phone: +1-607-777-4349 Email: Click Here |
Rabindra N. Das
MIT Lincoln Labs Advanced Technology Division 244 Wood St. Lexington MA 02420 USA Phone: +1-781-981-1318 Email: Click Here |
Ajit Dubey
GlobalFoundries 2600 Great America Way Santa Clara CA 95054 USA Phone: 408-904-8445 Email: Click Here |
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TengFei Jiang
University of Central Florida 4000 Central Florida Blvd Orlando FL 32816 USA Phone: 407-823-2284 Email: Click Here |
Ramakrishna Kotlanka
Analog Devices Mail Stop:113 804 Woburn Street Wilmington MA 01887-3494 USA Phone: +1-781-937-1076 Email: Click Here |
Kevin J. Lee
Qorvo Corporation 2300 NE Brookwood Parkway Hillsboro OR 97124 USA Phone: +1-503-615-9151 Email: Click Here |
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Menglu Li
Apple Inc. 1 Infinite Loop Cupertino CA 95014 USA Phone: +1-424-278-5674 Email: Click Here |
Bharat Penmecha
Intel Corporation CH5-157 5000 W. Chandler Blvd. Chandler AZ 85226 USA Phone: +1-480-552-2511 Email: Click Here |
C. S. Premachandran
GLOBALFOUNDRIES QRA-Reliability 400 Stonebreak Rd. Malta NY 12020 USA Phone: +1-518-305-7317 Email: Click Here |
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Jintang Shang
Southeast University Key Lab of MEMS of Education Ministry,Southeast University, Sipailou 2, Nanjing, P.R. China Sipailou 2 Nanjing 210096 P.R. China Phone: +86 13913869603 Email: Click Here |
Nancy Stoffel
GE Global Research KW-B1327 1 Research Circle Niskayuna NY 12309 USA Phone: +1-518-387-4529 Email: Click Here |
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Jimin Yao
Intel Corporation CH5-165 5000 W. Chandler Blvd Chandler AZ 85226 United States Phone: +1-217-299-7362 Email: Click Here |
W. Hong Yeo
Georgia Institute of Technology Pettit Microelectronics Research Center 791 Atlanta Drive NW Atlanta GA 30332 USA Phone: +1-404-894-3200 Email: Click Here |
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