Thermal/Mechanical Simulation & Characterization

Major Topics: Thermal, Mechanical Simulation and Characterization Including: Component, Board and System Level Modeling for Microelectronics, e.g., 3D Interconnects (TSV, Stacked Die, etc.), 2.5D Packaging (Si, Glass, Flexible Interposer, etc.), Wafer-Level-Package (WLP), Ball- Grid-Array (BGA), Embedded Packages with Active and Passive Components, System- in-Package (SiP), Power Electronic Modules, LED Packaging, and MEMS; Fab/Thin Wafer Handling, Wire Bonding and Assembly Manufacture Process; Reliability Modeling Related Fracture Mechanics, Fatigue, Electromigration, Warpage, Delamination/Moisture, Drop Test, Material Constitutive Relations and Characterization; Novel Modeling Including Multi-Scale and Multi-Physics Techniques and Solutions; Measurement Methodologies, Characterization and Correlations.

Przemyslaw Gromala
Robert Bosch GmbH
Automotive Elecronics
Tuebinger Str. 123
Reutlingen 72762
Phone: +49-162-8514983
Email: Click Here
Assistant Chair
Ning Ye
Western Digital

951 SanDisk Dr.
Milpitas CA 95035
Phone: +1-408-801-1278
Email: Click Here
Christopher J. Bailey
University of Greenwich
Old Royal Naval College
Park Row
London SE10 9LS
United Kingdom
Phone: +44 (0) 20 8331 8660
Email: Click Here
Kuo-Ning Chiang
National Tsinghua University

No. 101, Sec. 2, KungFu Rd.
HsinChu 300
Phone: +886-3-574-2925
Email: Click Here
Xuejun Fan
Lamar University
Department of Mechanical Engineering
PO Box 10028
Beaumont TX 77710
Phone: +1-409-880-7792
Email: Click Here
Nancy Iwamoto
Honeywell Performance Materials and Technologies
Advanced Materials
P.O. Box 547
Ramona CA 92065
Phone: +1-760-831-9511
Email: Click Here
Pradeep Lall
Auburn University
Dept. of Mechanical Engineering
201 Ross Hall
Auburn AL 36830
Phone: +1-334-844-3424
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Chang-Chun Lee
National Tsing hua University (NTHU)

No. 101, Sec. 2, KungFu Rd.
HsinChu 300
Phone: +886-3-5162410
Email: Click Here
Yong Liu
ON Semiconductor
MS 35-2E
82 Running Hill Road
South Portland ME 04106
Phone: +1-207-761-3155
Email: Click Here
Sheng Liu
Wuhan University
School of Power and Mechanical Engineering
No. 8, South Donghu Road, Wuchang District
Wuhan Hubei Province
Phone: +86-27-68774381
Email: Click Here
Erdogan Madenci
University of Arizona
Dept. of Aerospace and Mechanical Engineering

Tucson AZ 85721
Phone: +1-520-621-6113
Email: Click Here
Tony Mak
Wentworth Institute of Technology
Applied Mathematics and Engineering
550 Huntington Ave.
Boston MA 02115
Phone: +1-334-625-8669
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Karsten Meier
Technische Universit├Ąt Dresden
Institute of Electronic Packaging Technology
Mommsenstrasse 15
Dresden Saxony 01069
Phone: +49 351 463 - 36 594
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Erkan Oterkus
University of Strathclyde

Glasgow G4 0LZ
United Kingdom
Phone: +44 (0)141 548 3876
Email: Click Here
Sandeep Sane
Intel Corporation
5000 W. Chandler Blvd.
Chandler AZ 85226
Phone: +1-480-552-2701
Email: Click Here
Suresh K. Sitaraman
Georgia Institute of Technology
George W. Woodruff School of Mechanical Engineering
813 Ferst Dr., NW
Atlanta GA 30332
Phone: +1-404-894-3405
Email: Click Here
Wei Wang
Qualcomm Technologies, Inc.

5775 Morehouse Drive
San Diego CA 92121
Phone: +1-858-651-5933
Email: Click Here
G. Q. (Kouchi) Zhang
Delft University of Technology (TUD)
Delft Institute for Micro/Nanoelectronics and System
Feldmannweg 17
Delft 2600 BG
Phone: +31-6-24888240
Email: Click Here
Tieyu Zheng
Microsoft Corporation

One Microsoft Way
Redmond WA 98052
Phone: +1-425- 722-1141
Email: Click Here
Jiantao Zheng

Email: Click Here