Interconnections

Major Topics: Fan-Out and Fan-In, Wafer- and Panel-Level Interconnects, 2.5D/3D, TSV Interconnect Structures for Heterogeneous Integration and SiP, Co- Designs and Process/Performance Trade-Off, Thermal/Mechanical/Electrical Tests &Reliability, Embedded Systems; Si/Glass/Organic Interposers, PoP, WLCSP, Flip-Chip, Solder Bumping and Cu Pillar, TC Bonding, IMC Interconnect, Wirebonds, RDL, Conductive Adhesives, Flexible Substrates, Power Modules, Wearables, Interconnects for Bio-Medical, Automotive, Bio-Sensor, Energy Harvesting, and Harsh Environments. Materials & Processing: Wafer Level Packaging, Panel Processing & Materials Next Generation Packaging Substrates, Flexible and Wearable Electronics, Carbon Electronics, Battery Materials, 3D Materials and Processing, Emerging Electronic Materials, Novel Conductive and Non-Conductive Adhesives, Solder Alloys, Photoresist, Dielectrics and Under-Fill, Molding Compounds, Thermal Interface Materials, Optoelectronic Materials.

Chair
Katsuyuki Sakuma
IBM Corporation

1101 Kitchawan Rd, Route 134
Yorktown Heights NY 10598
USA
Phone: +1-914-945-2080
Email: Click Here
Assistant Chair
Nathan Lower
Rockwell Collins, Inc.
MS 108-101
400 Collins Road NE
Cedar Rapids IA 52498-0001
USA
Phone: +1-319-295-6687
Email: Click Here
Thibault Buisson
Yole Développement

Le Quartz, 75 Cours Emile Zola – 69100 Villeurbanne
Lyon 69006
France
Phone: +33 481 18 52 47
Email: Click Here
William Chen
Advanced Semiconductor Engineering, Inc.

1255 E Arques Ave
Sunnyvale CA 95085
USA
Phone: +1-408-250-4290
Email: Click Here
Kathy Cook
Tessera

3025 Orchard Parkway
San Jose CA 95134
USA
Phone: +1-512-970-9930
Email: Click Here
David Danovitch
University of Sherbrooke

45, Blvd de l’Aeroport
Bromont (QC) J2L 1S8,
Canada
Phone: 450-534-8000 X-1400
Email: Click Here
Rajen Dias
Amkor Technology, Inc.

2045 East Innovation Circle
Tempe AZ 85284
USA
Phone: +1-480-786-7813
Email: Click Here
Bernd Ebersberger
Intel Corporation
GSM FOM TOM CSP
Am Campeon 10-12
Neubiberg 85579
Germany
Phone: +49-89-998853-23281
Email: Click Here
Takafumi Fukushima
Tohoku University

6-6-12 Aza-Aoba, Aramaki, Aoba-Ku,
Sendai 980-8579
Japan
Phone: +81-22-795-6978
Email: Click Here
Thomas Gregorich
SanDisk

951 SanDisk Drive
Milpitas CA 95035-7933
USA
Phone: +1 208-297-0138
Email: Click Here
Li Li
Cisco Systems, Inc.
SJC-D/2/4
170 West Tasman Drive
San Jose CA 95134
USA
Phone: +1-408-527-0801
Email: Click Here
Changqing Liu
Loughborough University
Wolfson School of Mechanical & Manufacturing Engineering

Leicestershire Loughborough LE11 3TU
United Kingdom
Phone: +44-1509-227681
Email: Click Here
Wei-Chung Lo
ITRI

BLDG 14-\168, 195, Sec. 4, ChungHsing Rd.
Chutung, HsinChu 31040
Taiwan, ROC
Phone: +886-3-591-7024
Email: Click Here
James Lu
Rensselaer Polytechnic Institute
CII-6015/CIE
110 8th Street
Troy NY 12180
USA
Phone: +1-518-276-2909
Email: Click Here
Voya Markovich
Microelectronic Advanced Hardware Consulting, LLC

43 Twin Oaks Dr.
Kings Park NY 11754
USA
Phone: +1-631-544-4625
Email: Click Here
Lou Nicholls
Amkor Technology, Inc.

2045 East Innovation Circle
Tempe AZ 85284
USA
Phone: +1-480-786-7687
Email: Click Here
Gilles Poupon
CEA-Leti

17, rue des Martyrs
Grenoble Cedex 9 38054
France
Phone: +33-438-785-399
Email: Click Here
Lei Shan
IBM Corporation

Rt. 134, PO Box 218
Yorktown Heights NY 10598
USA
Phone: +1-914-945-2304
Email: Click Here
Ho-Young Son
SK Hynix

Icheon-si
Gyeonggi-do
South Korea
Phone: +82-31-630-2858
Email: Click Here
Chuan Seng Tan
Nanyang Technological University
S2-B2c-85
50 Nanyang Avenue
Singapore Singapore 639798
Singapore
Phone: +65-67905636
Email: Click Here
Matthew Yao
GE Energy Management

610 Epsilon Dr.
Pittsburgh PA 15238
USA
Phone: +1-412-963-3244
Email: Click Here
Dingyou Zhang
Qualcomm Technologies, Inc.
R-202D
5775 Morehouse Dr.
San Diego CA 92121
USA
Phone: +1 858-845-5905
Email: Click Here