High-Speed, Wireless & Components

Major Topics: Modules & Sub-Systems; High-Speed, F to THz Devices & Passive Components, Mixed-Signal; Electrical Modeling and Design; dvanced Components: Materials, Structures, Fabrication and Characterization; Power and Signal Integrity; High-Speed Data Transfer/Communications; Power Modules ,Power Management; Integrated Voltage Regulators (IVR); LTE, WLAN, 5G, mm Wave and THz T/R Modules; Radars; Imagers; Wearable and Sensor Technologies for Internet of Things (IoT); Flexible Electronics; 3D Printed RF Components and Modules; Automotive Sensors; RF-MEMS, RF-Opto, RFID and Tagging; M2M Platforms; Proximity Sensors; Ambient Intelligence; Wireless Power; Wireless Sensor and Computing Nodes; Wearable and Biomedical Electronics.

Chair
Kemal Aygun
Intel Corporation
CH5-157
5000 W. Chandler Blvd.
Chandler AZ 85226
USA
Phone: +1-480-552-1740
Email: Click Here
Assistant Chair
Wendem Beyene
Rambus Inc.

1050 Enterprise Way, Suite 700
Sunnyvale CA 94089
USA
Phone: +1-408-462-8366
Email: Click Here
Amit P. Agrawal
Microsemi Corporation

1380 Bordeaux Dr.
Sunnyvale CA 94089

Phone: +1-408-666-8452
Email: Click Here
Eric Beyne
IMEC

Kapeldreef 75
B-3001 Leuven
Belgium
Phone: +32-16-281-261
Email: Click Here
Prem Chahal
Michigan State University

2120 Engineering Building
East Lansing MI 48824
USA
Phone: +1-517-355-0248
Email: Click Here
Zhaoqing Chen
IBM Corporation
B002
2455 South Rd.
Poughkeepsie NY 12601
USA
Phone: +1-845-435-5595
Email: Click Here
Nan-Cheng Charles Chen
MediaTek Inc.
300
No.1, Dusing Rd. 1, Hsinchu Science Park
Hsinchu
Taiwan
Phone: +886-3-5670766, ext. 26293
Email: Click Here
Craig Gaw
NXP Semiconductor
CH240
1300 North Alma School
Chandler AZ 85224
USA
Phone: +1-480-814-5142
Email: Click Here
Abhilash Goyal
Velodyne


San Jose CA
USA
Phone: +1-404 - 615-614
Email: Click Here
Xiaoxiong (Kevin) Gu
IBM Corporation
M/S 36-111
P.O.Box 218 Route 134
Yorktown Heights NEW YORK 10598
USA
Phone: +1-914-945-2292
Email: Click Here
Rockwell Hsu
Cisco Systems, Inc.

425 E Tasman Dr.
San Jose CA 95134
USA
Phone: +1-480-612-1469
Email: Click Here
Lih-Tyng Hwang
National Sun Yat-Sen University


Kaohsiung 80424
Taiwan
Phone: +886-7-5252000 ext. 4485
Email: Click Here
Bruce Kim
City University of New York
Dept of Electrical Engineering
160 Convent Avenue
New York NY 10031
USA
Phone: +1-212-650-7934
Email: Click Here
Timothy G. Lenihan
TechSearch International

4801 Spicewood Springs Road, Suite 150
Austin TX 78759
USA
Phone: +1- 512-426-2054
Email: Click Here
Lianjun Liu
NXP Semiconductor, Inc.
MD CH330
1300 N Alma School Rd
Chandler AZ 85224
USA
Phone: +1-480-4134022
Email: Click Here
Rajen M Murugan
Texas Instruments

917 Clack Drive
Dallas TX 75044
USA
Phone: +1-214-567-6377
Email: Click Here
Nanju Na
Xilinx

2100 Logic Dr
San Jose CA 95124
USA
Phone: +1-408-879-5574
Email: Click Here
Dan Oh
Samsung

1, Samsungieonia-ro, Hwaseong-si
Gyeonggi-do 18448
South Korea
Phone: +82-10-4503-3700
Email: Click Here
P. Markondeya Raj
Georgia Institute of Technology
Packaging Research Center
813 Ferst Drive NW
Atlanta GA 30332
USA
Phone: +1-404 558 2615
Email: Click Here
Luca Roselli
University of Perugia
Department of Engineering
Via G. Duranti 93
Perugia 06125
Italy
Phone: +39-075-585-3633
Email: Click Here
Hideki Sasaki
Renesas Electronics Corporation
5-20-1
Josuihon-cho
Kodaira-shi Tokyo 187-8588
Japan
Phone:
Email: Click Here
Li-Cheng Shen
Wistron NeWeb Corporation

5 Lihsin Rd. VI, Hsinchu Science Park
Hsinchu 300
Taiwan
Phone: +886-3-666-7799 ext 7201
Email: Click Here
Manos M. Tentzeris
Georgia Institute of Technology
ECE Dept

Atlanta GA 30332-0250
USA
Phone: +1-404-385-6006
Email: Click Here
Maciej Wojnowski
Infineon Technologies AG

Am Campeon 1-12
Neubiberg 85579
Germany
Phone: +49 89 234 2653
Email: Click Here
Yong-Kyu Yoon
University of Florida

225 Larsen Hall
Gainesville FL 32611

Phone: +1-352-392-5985
Email: Click Here