Advanced Packaging

Major Topics: Fan-Out, 2.5 & 3D, TSV and Interposer, Heterogeneous Integration and SiP, Embedded and Advanced Substrates, MEMS & Sensors, Automotive, Power Module, Wearable & IoT, Bio and Medical, RF, Microwave, Millimeter-Wave & EMI, High Performance Computing and Data Center, Wafer Level & Panel Level Process, Advanced Flip-Chip, Advanced CSP and POP.

Chair
Young-Gon Kim
Integrated Device Technology, Inc.

6024 Silver Creek Valley Road
San Jose CA 95138
USA
Phone: +1-408-360-1545
Email: Click Here
Assistant Chair
Luu Nguyen
Texas Instruments Inc.
12300
PO Box 58090
Santa Clara CA 95052-8090
USA
Phone: +1-669-721-4786
Email: Click Here
Daniel Baldwin
H.B. Fuller Company
Suite 300A
3140 Northwoods Pkwy
Norcross GA 30071
USA
Phone: +1-678-990-3320
Email: Click Here
Bora Baloglu
Amkor Technology

2045 E Innovation Circle
Tempe AZ 85284
USA
Phone: +1-480 786 7307
Email: Click Here
Rozalia Beica
Dow Electronic Materials

455 Forest Street
Marlborough MA 01752
USA
Phone: 1-508-787-4691
Email: Click Here
Jianwei Dong
Dow Electronic Materials

455 Forest St.
Marlborough MA 01752
USA
Phone: +1-508-229-7117
Email: Click Here
Luke England
GLOBALFOUNDRIES


Malta NY
USA
Phone: +1-518-222-1860
Email: Click Here
Allyson Hartzell
Veryst Engineering

47A Kearney Road
Needham MA 02494
USA
Phone: 781-433-0433 x330
Email: Click Here
Beth Keser
Intel Corporation



Germany
Phone:
Email: Click Here
John Knickerbocker
IBM Corporation
06-032
1101 Kitchawan Road
Yorktown Heights NY 10598
USA
Phone: +1-914-945-3306
Email: Click Here
Steffen Kroehnert
Nanium S.A.
Airport Center Dresden
Hermann-Reichelt-Stra├če 3a
Dresden None
Germany
Phone: +49-171-5639472
Email: Click Here
John H. Lau
ASM Pacific Technology
3/F, Watson Centre,
16-22 Kung Yip Street, Kwai Chung, N.T.
Hong Kong
Hong Kong
Phone: +852-2619-2757
Email: Click Here
Markus Leitgeb
AT&S


Leoben 8700
Austria
Phone: +43-676-8955-4087
Email: Click Here
Mike Ma
Amkor Technology Taiwan (ATT)



Taiwan
Phone: +886-975-778628
Email: Click Here
Dean Malta
Micross Advanced Interconnect Technology

3021 East Cornwallis Rd.
Research Triangle Park NC 27709
USA
Phone: +1-919-248-8405
Email: Click Here
Deborah S. Patterson
Principal, Patterson Group

15401 S. 31st Place
Phoenix AZ 85048
USA
Phone: +1-480-703-5683
Email: Click Here
Raj Pendse
Qualcomm, Inc.

5245 Diamond Common
Fremont CA 94555
USA
Phone: 5107098076
Email: Click Here
Subhash L. Shinde
Notre Dame University
Center for Sustainable Energy
115 Stinson-Remick Hall
Notre Dame Indiana 46556
USA
Phone: +1-574-631-1425
Email: Click Here
Joseph W. Soucy
Draper
MS 80
555 Technology Square
Cambridge MA 02139-3563
USA
Phone: +1-617-258-2953
Email: Click Here
Kuo-Chung Yee
TSMC

168,Park Ave. 2, Hsinchu Science Park
Hsinchu County 308-44
Taiwan R.O.C.
Phone: +886-3-5636688 Ext. 7222920/7223012
Email: Click Here
Christophe Zinck
ASE

Dreve Richelle 161-Box 23
Waterloo 1410
Belgium
Phone: +33628566802
Email: Click Here