68th ECTC Highlights

Note: We will provide links to the presentations as they become available.

Event Presentations

1)      2018 Luncheon Keynote – "Package Advancement to Enable Artificial Intelligence, Autonomous Cars and Wearables in Near Future: Cost and Implications to Supply Chains"
Presenter: B C Ooi, Sr. Vice President, Global Operations, Broadcom Corporation

2)      2018 ECTC Special Session: Assembly Frontiers - New Methods and Applications
(Chair: Florian Herrault– HRL Laboratories)

   Jeffrey Demmin - Booz Allen / DARPA - Heterogeneous Integration at DARPA: Pathfinding and Progress in Assembly Approaches
   Stefan Behler - Besi - Disruptive Developments for Advanced Die Attach to Tackle the Challenges of Heterogeneous Integration
   Matthew Meitl - X-Celeprint - Assembly by Elastomers for Large-Scale Heterogeneously Integrated Optoelectronics and Related Systems
   Doris Tang - PlayNitride - Mass Transfer of Micro-LED chips for Next-Generation Displays
   Val Marinov - Uniqarta - Massively Parallel Laser-Enabled Transfer Technology for Heterogeneous Integration of High-Density SoC/SiP


Media Coverage

1) Solid State Technology
   IFTLE 386 IEEE EPS Awards at 2018 ECTC
   IEEE Electronics Packaging Society honors heterogeneous integration pioneer and other innovators

2) 3DInCites
   Fan-out is Hot, 3D Is Back, and 5G is Needed: The Inside Scoop from ECTC 2018
   Tech Round-up from ECTC 2018
   Co-Design Comes to ECTC 2018: You Can Lead A Horse to Water…
   ECTC 2018 Paves the Path to Heterogeneous Integration
   Special ECTC 2018 Session Focuses on Frontiers in Assembly Technology
   The Heterogeneous Integration Roadmap Explained by Bill Chen
   Tech Round-up from ECTC 2018

3) Circuits Assembly
   ECTC Boasts Record Crowds, FO-WLP Sessions Overflow