68th ECTC Highlights

Note: We will provide links to the presentations as they become available.

Event Presentations

1)      2018 Emerging Technologies Special Session - Soft Material-Enabled Electronics for Medicine, Healthcare, and Human-Machine Interfaces
(Chairs: W. Hong Yeo - Georgia Institute of Technology and C. S. Premachandran -

   Michael McAlpine - University of Minnesota
   Spike Narayan, IBM Research
   Todd Coleman - University of California, San Diego
   Aadeel Akhtar - Psyonic
   Rooz Ghaffari - Epicore Biosystems

2)      2018 ECTC Special Session: Assembly Frontiers - New Methods and Applications
(Chair: Florian Herrault– HRL Laboratories)

   Jeffrey Demmin - Booz Allen / DARPA - Heterogeneous Integration at DARPA: Pathfinding and Progress in Assembly Approaches
   Stefan Behler - Besi - Disruptive Developments for Advanced Die Attach to Tackle the Challenges of Heterogeneous Integration (Paper | Presentation)
   Matthew Meitl - X-Celeprint - Assembly by Elastomers for Large-Scale Heterogeneously Integrated Optoelectronics and Related Systems
   Doris Tang - PlayNitride - Mass Transfer of Micro-LED chips for Next-Generation Displays
   Val Marinov - Uniqarta - Massively Parallel Laser-Enabled Transfer Technology for Heterogeneous Integration of High-Density SoC/SiP

3)      2018 IEEE ECTC Panel Session on I/C Package Co-Design for Heterogeneous Integrated Systems
(Chairs: Avi Bar-Cohen - EPS President/Raytheon and Chris Bailey - EPS VP/University of Greenwich, UK)

   Harrison Chang - ASE Group - Heterogeneous Integration & SiP
   John Parry - Mentor - Thermal Sign-Off Analysis for Advanced 3D IC Integration
   Yong Liu - ON Semiconductor - Power Electronic Packaging, Co-Design and Reliability
   Xuejun Fan - Lamar University - Multi-Physics and Multi-Scale Modeling
   Swaminathan Madhavan - Georgia Institute of Technology - Multi-physics modelling for Flexible Hybrid Electronics
   Andrew Kahng - University of California, San Diego - Co-Design Pain Points, Tooling Gaps, and Lessons from the Past

4)      2018 Luncheon Keynote – "Package Advancement to Enable Artificial Intelligence, Autonomous Cars and Wearables in Near Future: Cost and Implications to Supply Chains"
Presenter: B C Ooi, Sr. Vice President, Global Operations, Broadcom Corporation

5)      2018 IEEE ECTC Plenary Session - Artificial Intelligence and Its Impact on System Design
(Chair: Kemal Aygun - IntelCorporation)

   Igor Arsovski - GLOBALFOUNDRIES
   Kailash Gopalakrishnan - IBM Corporation
   Andrew Putnam - Microsoft Corporation
   Madhavan Swaminathan - Georgia Institute of Technology
   Dan Oh - Samsung

6)      2018 IEEE EPS Seminar - High Density Packaging Technologies in the Era of Big Data
(Chairs: Chairs: Yasumitsu Orii - Nagase, Japan and Sheigenori Aoki – Fujitsu, Japan)

   Shunichi Kikuchi - Fujitsu - System Packaging Solution for Future High Performance Computing
   Spike Narayan, IBM Research
   Urmi Ray - JCET StatsChipPac - High Density Packaging Needs for Next Generation Connected Markets
   Masato Tanaka, Shinko
   Toshihisa Nonaka - Hitachi Chemical - Material technology enhances the density and the productivity of the package

Media Coverage

1) Solid State Technology
   IFTLE 386 IEEE EPS Awards at 2018 ECTC
   IEEE Electronics Packaging Society honors heterogeneous integration pioneer and other innovators

2) 3DInCites
   Fan-out is Hot, 3D Is Back, and 5G is Needed: The Inside Scoop from ECTC 2018
   Tech Round-up from ECTC 2018
   Co-Design Comes to ECTC 2018: You Can Lead A Horse to Water…
   ECTC 2018 Paves the Path to Heterogeneous Integration
   Special ECTC 2018 Session Focuses on Frontiers in Assembly Technology
   The Heterogeneous Integration Roadmap Explained by Bill Chen
   Tech Round-up from ECTC 2018

3) Circuits Assembly
   ECTC Boasts Record Crowds, FO-WLP Sessions Overflow

4) Chip Scale Review
   Report from ECTC 2018