64th ECTC Highlights
Best Papers
Best Session Paper
"Exploration of Aging Induced Evolution of Solder Joints Using Nanoindentation and Microdiffraction" by Mohammad Hasnine, Jeffrey C. Suhling, Barton C. Prorok, Michael J. Bozack, and Pradeep Lall, Auburn University
Best Interactive Presentation Paper
"Study of Microwave Circuits Based on Metal-Insulator-Metal (MIM) Diodes on Flex Substrates" by Amanpreet Kaur, Xianbo Yang, and Premjeet Chahal, Michigan State University
Outstanding Session Paper
"Three-Dimensional High-Density Channel Integration of Polymer Optical Waveguide Using the Mosquito Method" by Takaaki Ishigure, Daisuke Suganuma, and Kazutomo Soma, Keio University
Outstanding Interactive Presentation Paper
"CO2-Laser Drilling of TGVs for Glass Interposer Applications" by Lars Brusberg and Henning Schröder, Fraunhofer IZM; Marco Queisser, Marcel Neitz, and Klaus-Dieter Lang, Technical University Berlin
Intel Best Student Paper
“A Novel Fine Pitch TSV Interconnection Method Using NCF with Zn Nano-Particles” by Ji-Won Shin, Yong-Won Choi, Young Soon Kim, Un Byung Kang, Sun Kyung Seo, and Kyung-Wook Paik, Korea Advanced Institute of Science and Technology (KAIST)
Event Presentations
1) 2014 ECTC Special Session: Flexible Electronics – Packaging Technology and Application Trends (Chaired by Karlheinz Bock)
Vivek Subramanian, University of California-Berkeley
Jan Vardaman, TechSearch International
Christoph Kutter, Fraunhofer EMFT
Mitsuru Hiroshima, Panasonic
Nancy Stoffel, GE Global Research
2) 2014 Electronic Components & RF Special Session: Wireless Power Transfer Systems (Chaired by Manos Tentzeris and Craig Gaw)
Michael de Rooij, EPC
Lilly Huang, Intel Corporation
Yogesh Ramadass, Texas Instruments
Francesco Carobolante, Qualcomm Technologies, Inc.
Robert Andosca, Microgen Systems
3) 2014 ECTC Panel Session: Emerging Technologies and Market Trends of Silicon Photonics (Chaired by Ricky Lee and Jie Xue)
Michael Watts, MIT
Stéphane Bernabe, CEA-Leti
John Cunningham, Oracle
Jean Trewhella, IBM Corporation
Peter De Dobbelaere, Luxtera
Madeleine Glick, APIC Corporation
4) 2014 ECTC Plenary Session: Packaging Influence on System Integration and Performance (Chaired by Nancy Stoffel)
Jon Casey, IBM Corporation
Stephane Lessard, Ericsson
Raj Master, Microsoft
Li Li, Cisco Systems, Inc.
Nozad Karim, Amkor
5) 2014 CPMT Seminar: Latest Advances in Organic Interposers (Chaired by Kishio Yokouchi and Venky Sundaram)
Yasumitsu Orii, IBM Japan, Ltd.
Suresh Ramalingam, Xilinx Inc.
Tadashi Kodaira, Shinko Electric Industries Co. Ltd.
Mitsuya Ishida, Kyocera SLC Technologies Corp.
6) 2014 ECTC Luncheon Keynote
Keynote presentation by Peter L. Bocko – Corning, Inc.
7) Corning, Inc. Glass Learning Studio
The Science Behind Glass - Ron Stewart
Dispelling Some Myths About Glass - Ron Stewart
Life Changing Glass Innovations - Gary Trott
For more information, please see:
www.corning.com/semiglass
Media Coverage
1) Solid-State Technology
Insights From Leading Edge, IFTLE 207 IEEE ECTC part 2: Advances in Fan-out Packaging, Dr. Phil Garrou, Contributing Editor.
2) Solid-State Technology
IEEE Packaging Awards handed out at 2014 ECTC, Dr. Phil Garrou, Contributing Editor
3) Google Translated Articles by Hirofumi Nakajima in Nikkei Technology Online
"Qualcomm presents: Challenges and Opportunities of Chip Package Interaction with Fine Pitch Cu Pillar" Hirofumi Nakajima, Asia & Pacific Rim IEEE CPMT Society
"Revolutionizing 2.5D technology: ultra-high density organic interposer" Hirofumi Nakajima, Asia and Pacific rim IEEE CPMT Society
"Active Die Embedded Small Form Factor RF Packages" Hirofumi Nakajima, Asia and Pacific rim IEEE CPMT Society
"IBM announced results that give a boost to the popularization of 3D-TSV" Nakajima Hirofumi, Program Director, Asia and Pacific Rim, IEEE CPMT Society
4) Yahoo Finance
"Kingyoup Unveils High Throughput Semiconductor Wafer Bonding & Debonding Tool at ECTC 2014"
5) 3D InCites
"Are Design Tools and Thermal Solutions the Missing Links to 2.5D and 3D IC Production?" by Francoise von Trapp
"Fine Tuning Processes for TSV Reveal", by Francoise von Trapp
"A Preview of 2.5D and 3D Activities"
"Bridging the Gap to 2.5D and 3D"
"Glass Interposers Take the Stage at ECTC 2014"
6) Reflections from the 64th ECTC – CPMT Society Newsletter Article by Sam Karikalan
