63rd ECTC Highlights
Best Papers
Best Session Paper
“Grain Structure Evolution and its Impact on the Fatigue Reliability of Lead-Free Solder Joints in BGA Packaging Assembly” by Huili Xu, Choong-Un Kim, University of Texas, Arlington, and Tae-Kyu Lee, Cisco Systems, Inc.
Best Interactive Presentation
“Bath Chemistry and Copper Overburden as influencing Factors of the TSV Annealing” by P. Saettler, M. Boettcher, Catharina Rudolph, and K.-J. Wolter, Technische Universität Dresden
Outstanding Session Paper
“Effects of Varying Amplitudes on the Fatigue Life of Lead Free Solder Joints” by M. Obaidat,S. Hamasha, Y. Jaradat, A. Qasaimeh, P. Borgesen, State University of New York, Binghamton; B. Arfaei, M. Anselm, Universal Instruments Corporation
Outstanding Interactive Presentation
“Fabrication and Characterization of Novel Photodefined Polymer-Enhanced Through-Silicon Vias for Silicon Interposers” by Paragkumar A. Thadesar and Muhannad S. Bakir, Georgia Institute of Technology
Intel Best Student Paper
“Low temperature fine pitch Flex-on-Flex (FOF) assembly using nanofiber Sn58Bi solder anisotropic conductive films (ACFs) and ultrasonic bonding method” by Tae Wan Kim, Kyung-Lim Suk and Kyung-Wook Paik, Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Korea.
Event Presentations
1) Special Session: The Role of Wafer Foundaries in Next Generation Packaging (Chaired by Sam Karikalan)
Presentation by David McCann - GLOBALFOUNDRIES
Presentation by Kurt Huang - UMC
Presentation by Jon Casey - IBM
Presentation by Sudipto Roy & Herb Huang - SMIC
2) 2013 CPMT Seminar: Advanced Low Loss Dielectric Materials for High Frequency and High Bandwidth Applications (Chaired by Kishio Yokouchi and Venky Sundaram)
Presentation by Yasuyuki Mizuno - Hitachi Chemical Co., Ltd.
Presentation by Shin Teraki - Namics Corporation
Presentation by Hirohisa Narahashi - Ajinomoto
Presentation by Yuya Suzuki - Zeon Corporation
3) 2013 ECTC Panel Session (chaired by Ricky Lee and Kouchi Zhang)
“China’s SSL Development” by Ling Wu, Secretary General of Chinese SSL Alliance
“LED Manufacturing: Could Silicon displace Sapphire?” by Michael McLaughlin, Yole Development
“LED Packaging” by Ron Bonne, Philips Lumileds
“Smarter Lighting – European Perspective” by Nils Erkamp, TNO
“Cree Perspective on SSL” by Mark McClear, Cree
4) 2013 ECTC Luncheon Keynote
Keynote presentation by Chris Welty – IBM Research
Media Coverage
3D Incites
a. “Technology Updates at ECTC 2013”, Blog post by Francoise von Trapp
b. “3D IC Business Model: A Customer Decision”, Blog post by Francoise von Trapp
c. “ECTC 2013 Interview: SSEC’s Laura Mauer Talks about TSV Reveal and TSV Clean”, Blog post by Francoise von Trapp
d. “ECTC 2013 Interview: SPTS’s Keith Buchanan Addresses Bow and Warp”, Blog post by Francoise von Trapp
e. “ECTC 2013 Interview: Dow Corning throws its Hat in the Temporary Bond/Debond Ring”, Blog post by Francoise von Trapp
f. “ECTC 2013 Interview: Multitest Execs Tout Partial Stack Test for 3D ICs”, Blog post by Francoise von Trapp
Chip Scale Review
a. “ECTC 2013 Confirms Gains in 2.5D and 3D Integration”, July – Aug 2013 edition - page 66 and 67.
IEEE CPMT Society Newsletter
a. “63rd Electronic Components and Technology Conference (ECTC): A True Banner Year”, Summary Report by Henning Braunisch in Summer 2013 edition.
I-Micronews
a. “Record attendance for 63rd IEEE ECTC in Las Vegas”
b. “New spin-on temporary bonding solution from Dow Corning: a closer look”
Nikkei BP Semiconductor Research
a. “1300 people a record - The number of ECTC participants achieved a new record”, Article by Masahide Kimura
b. “[ECTC] Intel microprocessor technology for servers - Embedded capacitors applied to the package substrate of”, Article by Masahide Kimura
c. “[ECTC] Development of a flip-chip bonding technology that supports the coreless package substrate”, Article by Masahide Kimura
d. “[ECTC] Reliability of 2.5-dimensional LSI technology using TSMC "CoWoS"”, Article by Masahide Kimura
e. “[ECTC] Probing correlation of device reliability and conditions of the Cu wire bonding”, Article by Hirofumi Nakajima
f. “[ECTC] Development of the electron microscope…”, Article by Hirofumi Nakajima
g. “[ECTC] The three-dimensional stack and 28nm-generation logic”, Article by Hirofumi Nakajima
