2024 IEEE ECTC Press Kit
Welcome to the Editor Press Center. The following press materials may be downloaded from this site for news coverage of the 2024 IEEE ECTC.
Contacts
Gary Dagastine
co-Media Relations Director
+1 518 785 2724
[email protected]
Chris Burke
co-Media Relations Director
1 919 872 8172
[email protected]
2024 IEEE ECTC Press Releases:
Welcome to the Editor Press Center. Check back periodically for photo and caption updates.
2024 IEEE ECTC Photos with captions:
Selected images from the papers will be presented in two formats:
– Word file with images associated with a highlighted paper and the caption
– JPEG file with individual high-resolution images
Paper 2.4, Novel Three-Layer Stacking Process With Face-to-Back CoW 6 µm-Pitch Hybrid Bonding
Paper 3.1, High Density Integration of Silicon Photonic Chiplets for 51.2T Co-Packaged Optics
Paper 8.2, 3-Layer Fine Pitch Cu-Cu Hybrid Bonding Demonstrator With High Density TSV For Advanced CMOS Image Sensor Applications
Paper 9.5, IR Laser Debond From Silicon Carrier Wafers With Inorganic Thin Film Release Layers for High-Density 2.5D and 3D Integration
Paper 11.1, Reworkable Superconducting Qubit Package for Quantum Computing
Paper 12.6, Analysis of Mechanical Behavior of Hybrid SAC-LTS Joints Under Temperature Cycling with a Modified Garofalo Creep Model Based On Bi Concentration
Paper 16.7, BGA Electromigration Behavior And Why It Has Become the Bottleneck
Paper 19.5, Methodologies For Characterization Of W2W Bonding Strength
Paper 22.3, System-Level Analysis And Design Optimization of Back-side Power Delivery Network for Advanced Nodes
Paper 23.1, Advanced Thermocompression Bonding Application On High-Density Fan-Out Embedded Bridge Technology For HPC/AI/ML
Paper 24.6, Optimized Simulation Methodology of Warpage Localized Stress Hotspot Prediction For Assembly Risk Assessment
Paper 25.7, A Novel DC-DC Converter Module Using The Integrated Package Solution (iPaS) Substrate For Next Generation High Performance Computing (HPC) Applications
Paper 33.2, Novel Negative-Tone Dry Film Resist And Process For Fine Pitch Copper Wiring With L/S = 1.5/1.5 µm On Build-up Substrate
Paper 34.6, Ultra-Compact Computing At The Edge Involving Unobtrusively Small Sub-millimeter Heterogeneous Integration Packaging
Interactive Presentation 38.5, The Energy-Efficient 10-Chiplet AI Hyperscale NPU On Large-Scale Advanced Package
Paper 41, Reliability Of Indium Solder Joints Using A Laser-Assisted Bonding (LAB) Process At Room Temperature
ATTENDANCE AT ECTC IS COMPLIMENTARY FOR THE PRESS.
If you plan to attend, please let us know. Whether you would like to do a news story, conference preview or an in-depth exploration of a particular technology, please contact one of us for the additional information or interviews you may need.
Editor Contacts:
Gary Dagastine, co-Media Relations Director, at [email protected] or by telephone at +1 518 785 2724
Chris Burke, co-Media Relations Director, at [email protected] or by telephone at +1 919 872 8172
General registration/attendance questions can be answered by Lisa Renzi, at [email protected]
About IEEE & EPS
IEEE is the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity. Through its highly cited publications, conferences, technology standards, and professional and educational activities, IEEE is the trusted voice on a wide variety of areas ranging from aerospace systems, computers and telecommunications, to biomedical engineering, electric power, and consumer electronics.
The IEEE’s Electronics Packaging Society (EPS) sponsors the ECTC conference. EPS is the leading international forum for scientists and engineers engaged in research, design and development of revolutionary advances in microsystems packaging and manufacturing. Its areas of interest encompass all aspects of packaging and integration of electrical, electronic, optoelectronic, biological, micromechanical and sensing components.
